DOWSIL TC-5550 Thermal Conductive Compound

Zde se nacházíte: Produkty> Chemicko - technické produkty> Elektrochemie> Teplovodivé produkty> DOWSIL TC-5550 Thermal Conductive Compound

Vyberte produktDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5515 LT Low Density Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxidový teplovodivý zalévací systémELECTROLUBE HTC – Bezsilikonová teplovodivá pastaELECTROLUBE HTCP – Bezsilikonová teplovodivá pasta - PLUSELECTROLUBE HTCPX – Bezsilikonová tepl. pasta PLUS XELECTROLUBE HTCPX_LV – Bezsil. tepl. pasta s nízkou viskozitouELECTROLUBE HTCX – Bezsilikonová teplovodivá pasta XELECTROLUBE HTS – Silikonová teplovodivá pasta ELECTROLUBE HTSP – Silikonová teplovodivá pasta PlusELECTROLUBE TCOR – Teplovodivý Oxime RTV tmelThermal management solutions

EN AT DE CZ HU SI SK HR 

DOW

DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND

Odeslat dotaz na tento produkt

DOWSIL TC-5550 Thermal Conductive Compound is a high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare die architecture to provide long term reliability with excellent pump-out resistance performance. 

Features & Benefits

• Good pump-out resistance for bare die application
• High thixotropy index(> 14)and solvent free formulation 
• High thixotropy index(> 14)and solvent free formulation 
• High thermal conductivity: 5.0W/mk
• Achieves thin Bond Line Thickness (BLT): 0.02mm at 40 psi
• Low thermal resistance: 0.04 °C-cm2/W at 40 psi

Pdf:

• TDS DOWSIL TC 5550 Thermal Conductive Compound eng.pdf
  
  

Odeslat dotaz na tento produkt

DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND

Prosím, vyplňte všechna pole.Prosím, vyplňte prázdné pole.

0

I agree with the Legal terms and I read Ochrana dat.

I authorize you to notify me about interesting news and events via e-mails.
If you no longer wish to receive our e-mails in the future, you can opt out of them at any time via a link at the end of each newsletter or send us an e-mail at ulbrich@ulbrich.cz. Your information will be processed in accordance with legal regulations.

Ochrana dat

Děkujeme za Váš dotaz!
Budeme Vás kontaktovat co nejdříve!