DOWSIL TC-4535 CV Thermally Conductive Gap Filler

Zde se nacházíte: Produkty> Chemicko - technické produkty> Elektrochemie> Teplovodivé produkty> DOWSIL TC-4535 CV Thermally Conductive Gap Filler

Vyberte produktDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Epoxy ResinELECTROLUBE ER2183 – Epoxidový teplovodivý zalévací systémELECTROLUBE HTC – Bezsilikonová teplovodivá pastaELECTROLUBE HTCP – Bezsilikonová teplovodivá pasta - PLUSELECTROLUBE HTCPX – Bezsilikonová tepl. pasta PLUS XELECTROLUBE HTCPX_LV – Bezsil. tepl. pasta s nízkou viskozitouELECTROLUBE HTCX – Bezsilikonová teplovodivá pasta XELECTROLUBE HTS – Silikonová teplovodivá pasta ELECTROLUBE HTSP – Silikonová teplovodivá pasta PlusELECTROLUBE TCOR – Teplovodivý Oxime RTV tmelThermal management solutions

EN AT DE CZ HU SI SK HR 

DOW

DOWSIL TC-4535 CV THERMALLY CONDUCTIVE GAP FILLER

Odeslat dotaz na tento produkt

DOWSIL TC-4535 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

Features/Properties:

• 3.5 W/m.K Silicone Gap Filler
• Room temperature cure or heat accelerated cure
• Long term performance stability during temperature cycling up to 150°C
• Holds vertical position in the assembly for long service period
• Controlled silicone volatility
• UL 94 V pending

Pdf:

• TDS DOWSIL TC 4535 CV Thermally Conductive Gap Filler eng.pdf