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DOWSIL™ SE 9100 Black Adhesive is a one-part silicone formulation that achieves fast tack-free processing at room temperature, providing fast in-line processing while allowing reworkability for PCB system assemblies.
It is generally cured at room temperature and in an environment of 30 to 80 percent relative humidity, eliminating the need for curing ovens and the associated costs of energy and capital. Faster manufacturing throughput can be achieved since the adhesive and component can be handled in much shorter times of about 10 to 120 minutes, depending on the adhesive selected and the amount applied.
Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product. Mild heat below 60°C (140°F) may be used to increase through-put by accelerating the cure.
DOWSIL™ SE 9100 Adhesive retains its original physical and electrical properties over a broad range of operating conditions offering enhanced reliability, service life and cost-effective processing of mobile, display modules and other consumer devices.
Room temperature curing
Fast tack-free curing at room temperature
Good flow, fill or self-leveling after dispensing
Retains good sealing against water and contaminants